Sony on Monday announced its latest and thinnest back-illuminated CMOS image sensor that will no doubt help manufacturers create thinner smartphones. “Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors,” Sony explained in its announcement. “By this stacked structure, large-scale circuits can now be mounted keeping small chip size.” The chip’s features include: Large-scale signal processing circuits required for higher image quality and better functionality are built-in More compact image sensor chip size Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior
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